Nano Technology Based Broad Spectrum Fungicide
Broad Spectrum Fungicide
Mode of Action :
Contact Protection : Copper remains on the plant surface and acts only at the site of deposition, forming a protective barrier.
Ion Release & Enzyme Denaturation : In the presence of moisture, copper releases \(\text{Cu}^{2+}\) ions that denature fungal enzymes and proteins, disrupting vital cell functions.
Membrane Damage & Growth Inhibition: Copper damages fungal cell membranes, causing leakage and cell death, while inhibiting spore germination and mycelial growth.
Oxidative DNA Damage : CuNPs generate \(\cdot \text{OH}\) radicals via Fenton reaction, which fragments pathogen DNA and suppresses ergosterol synthesis in fungi.
Protein Binding Effects: Cu²⁺ ions bind to thiol (-SH) groups in microbial proteins, causing lipid peroxidation, membrane leakage, and enzyme denaturation.
Benefits :
Preventive Disease Protection : Works as a protective barrier on the plant surface, helping prevent fungal infection at the early stage.
Rapid Fungicidal Activity : Moisture-triggered Cu²⁺ ion release provides quick toxic action against fungi, improving control efficiency.
Broad-Spectrum Disease Suppression : Provides effective control against a wide range of fungal pathogens by targeting multiple cellular components, ensuring comprehensive disease management across crops.
Stops Disease Spread : By blocking mycelial growth, it helps reduce further infection and secondary spread in the field.
Spore Germination Suppression : Inhibits spore germination, lowering disease pressure and promoting healthier, cleaner crop growth.
5 ml/Ltr of water or 2-3 gm/Ltr of water
Foliar Application